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 HT48RA0-5 Remote Type 8-Bit OTP MCU
Features
* Operating voltage: * Carrier output pin (REM) * Build-in IR Driver (350mA@3.0V) * Watchdog Timer * Low voltage reset function * Power-down and wake-up features reduce power
fSYS=4MHz at VDD=2.0V~3.6V (LVR enabled) fSYS=4MHz at VDD=1.8V~3.6V (LVR disabled)
* Oscillator types:
External high frequency Crystal -- HXT Internal high frequency RC -- HIRC
* 1K14 program memory * 328 data RAM * One-level subroutine nesting * 17 bidirectional I/O lines * Fully integrated internal 4095kHz oscillator requires
consumption
* 14-bit table read instructions * Up to 1ms instruction cycle with 4MHz system clock * 62 powerful instructions * All instructions executed in 1 or 2 machine cycles * Bit manipulation instructions * 16-pin NSOP and 20-pin SSOP packages
no external components
* One programmable carrier output - using 9-bit timer
General Description
The HT48RA0-5 is 8-bit high performance, RISC architecture microcontroller device specifically designed for multiple I/O control product applications. The advantages of low power consumption, I/O flexibility, timer functions, watchdog timer, HALT and wake-up functions, as well as low cost, enhance the versatility of this device to suit a wide range of application possibilities such as industrial control, consumer products, and particularly suitable for use in products such as infrared remote controllers and various subsystem controllers.
Rev.1.10
1
June 10, 2010
HT48RA0-5
Block Diagram
W a tc h d o g T im e r S ta c k 8 - b it R IS C MCU C o re I/O P o rts 9 - b it T im e r REM O u tp u t Low V o lta g e R eset R eset C ir c u it E x te rn a l X T A L C o n tr o lle r In te rn a l R C O s c illa to r W a tc h d o g T im e r O s c illa to r
OTP P ro g ra m M e m o ry
D a ta M e m o ry
Pin Assignment
VSS 1 2 3 4 5 6 7 8 9 10 P C 0 /R E S VDD 1 2 3 4 5 6 7 8 VSS P C 0 /R E S PB7 P B 6 /O S C 1 P B 5 /O S C 2 PB4 PA7 16 15 14 13 12 11 10 9 REM PA0 PA1 PA2 PA3 PA4 PA5 PA6 PB7 P B 6 /O S C 1 P B 5 /O S C 2 PB4 PB3 PB2 PB1 PB0 20 19 18 17 16 15 14 13 12 11 VDD REM PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7
H T 4 8 R A 0 -5 1 6 N S O P -A
H T 4 8 R A 0 -5 2 0 S S O P -A
Pin Description
Pin Name I/O Configuration Option 3/4 Description Bidirectional 8-bit input/output port with pull-high resistors. Software instructions determine if the pin is an NMOS output or Schmitt Trigger input. Each pin can have a wake-up function if configured as an input pin. Bidirectional 8-bit input/output port with pull-high resistors. Software instructions determine if the pin is an NMOS output or Schmitt Trigger input. Each pin can have a wake-up function if configured as an input pin. PB5 and PB6 are pin-shared with the external crystal pins named OSC2 and OSC1 respectively determined by a configuration option. Bidirectional 1-bit input/output port without a pull-high resistor. Software instructions determine if the pin is an NMOS output or Schmitt Trigger input. This pin has the capability of wake-up when it is configured as an input pin. PC0 is pin-shared with the external reset pin named RES determined by a configuration option. Carrier output dual function pin. REM is a CMOS carrier output pin with an initial low level after a reset. REM pin is a high sink current NMOS open drain carrier output pin which will be in a floating condition after a reset. The selection of REM or REMDRV is determined by a configuration option. Positive power supply Negative power supply, ground
PA0~PA7
I/O
PB0~PB4 PB5/OSC2 PB6/OSC1 PB7
I/O
OSC
PC0/RES
I/O
RES
REM
O
REMDRV
VDD VSS
3/4 3/4
3/4 3/4
Rev.1.10
2
June 10, 2010
HT48RA0-5
Absolute Maximum Ratings
Supply Voltage ...........................VSS-0.3V to VSS+4.0V Input Voltage..............................VSS-0.3V to VDD+0.3V IOL Total ..............................................................150mA Total Power Dissipation .....................................500mW Storage Temperature ............................-50C to 125C Operating Temperature...........................-20C to 70C IOH Total............................................................-100mA
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
D.C. Characteristics
Test Conditions Symbol Parameter VDD VDD IDD ISTB1 ISTB2 VIL VIH VIL VIH IOH IOL1 IOL2 IOL3 RPH VLVR VPOR RPOR Operating Voltage Operating Current Standby Current Standby Current Input Low Voltage for I/O Ports Input High Voltage for I/O Ports Input Low Voltage for RES Ports Input High Voltage for RES Ports REM Output Source Current PA, PB, REM Output Sink Current PC0 Sink Current REM Output Sink Current Pull-high Resistance of Port A, Port B Low Voltage Reset Voltage VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset 3/4 3V 3V 3V 3/4 3/4 3/4 3/4 3V 3V 3V 3V 3V 3/4 3/4 3/4 Conditions LVR disable LVR enable No load, fSYS=4MHz No load, system HALT, WDT disable No load, system HALT, WDT enable 3/4 3/4 3/4 3/4 VOH=0.9VDD VOL=0.1VDD VOL=0.1VDD VOL=0.2VDD 3/4 3/4 3/4 3/4 1.8 2.0 3/4 3/4 3/4 0 0.8VDD 0 0.9VDD -5 6 0.8 300 100 1.8 3/4 0.035 3/4 3/4 0.7 0.1 3/4 3/4 3/4 3/4 3/4 -7 12 1.2 350 150 1.9 3/4 3/4 3.6 3.6 1.5 1.0 5.0 0.2VDD VDD 0.4VDD VDD 3/4 3/4 3/4 3/4 200 2.0 100 3/4 Min. Typ. Max.
Ta=25C Unit V V mA mA mA V V V V mA mA mA mA kW V mV V/ms
Rev.1.10
3
June 10, 2010
HT48RA0-5
A.C. Characteristics
Symbol fSYS fHIRC tSST Parameter System Clock System Clock (HIRC) System Start-up Timer Period Test Conditions VDD 1.8V~ 3.6V 1.8V~ 3.6V 3/4 3V 3/4 3/4 3/4 3/4 Conditions Ta= -20C ~ 70C Ta= -20C ~ 50C Power-up or wake-up from HALT Min. 400 4013 3/4 45 0.25 1 Typ. 3/4 4095 1024 90 1.00 3/4 Max. 4000 4179 3/4 180 2.00 3/4 Ta=25C Unit kHz kHz tSYS ms ms ms
tWDTOSC Watchdog Oscillator tLVR tPOR Low Voltage Width to Reset Power-on Reset Low Pulse Width
Note: tSYS=1/fSYS
Power-on Reset Characteristics
Test Conditions Symbol VPOR RRVDD tPOR Parameter VDD VDD Start Voltage to Ensure Power-on Reset VDD raising rate to Ensure Power-on Reset Minimum Time for VDD Stays at VPOR to Ensure Power-on Reset 3/4 3/4 3/4 Conditions 3/4 3/4 3/4 3/4 0.035 1 3/4 3/4 3/4 100 3/4 3/4 mV V/ms ms Min. Typ. Max. Unit
V
DD
tP
OR
RR
VDD
V
POR
T im e
Rev.1.10
4
June 10, 2010
HT48RA0-5
Characteristics Curves
IR D r iv e r C u r v e 500 -1 0 C 2 5 C S in k C u r r e n t (m A ) 400 350 300 3 5 C 5 0 C
450
REM
250 200
150
3 .6
3 .3
3 .0
2 .6 V D D (V )
2 .3
2 .0
1 .8
H IR C C u r v e 4200 4180 4160 4140 F re q u e n c y (k H z ) 4120 4100 4080 4060 4040 4020 4000 3 .6 3 .4 3 .2 3 .0 2 .8 V D D (V ) 2 .6 2 .4 2 .2 2 .0 1 .8 4095kH z -2% 5 0 C 3 5 C -2 0 C 2 5 C 4095kH z + 2%
Rev.1.10
5
June 10, 2010
HT48RA0-5
Functional Description
Execution Flow The main system clock is derived from either an external crystal oscillator which requires the connection of the external crystal or resonator or an internal RC oscillator which requires no external component for its operation. It is internally divided into four non-overlapping clocks. One instruction cycle consists of four system clock cycles. Instruction fetching and execution are pipelined in such a way that a fetch takes one instruction cycle while decoding and execution takes the next instruction cycle. However, the pipelining scheme causes each instruction to effectively execute within one cycle. If an instruction changes the program counter, two cycles are required to complete the instruction. Program Counter - PC The 10-bit program counter (PC) controls the sequence in which the instructions stored in program memory are executed and its contents specify a maximum of 1024 addresses. After accessing a program memory word to fetch an instruction code, the contents of the program counter are incremented by one. The program counter then points to the memory word containing the next instruction code. When executing a jump instruction, conditional skip execution, loading PCL register, subroutine call, initial reset or return from subroutine, the PC manipulates the program transfer by loading the address corresponding to each instruction. The conditional skip is activated by instruction. Once the condition is met, the next instruction, fetched during the current instruction execution, is discarded and a dummy cycle replaces it to get the proper instruction. Otherwise proceed with the next instruction. The lower byte of the program counter (PCL) is a readable and writeable register (06H). Moving data into the PCL performs a short jump. The destination will be within 256 locations. When a control transfer takes place, an additional dummy cycle is required.
T1 S y s te m C lo c k
T2
T3
T4
T1
T2
T3
T4
T1
T2
T3
T4
In s tr u c tio n C y c le PC PC PC+1 PC+2
F e tc h IN S T (P C ) E x e c u te IN S T (P C -1 )
F e tc h IN S T (P C + 1 ) E x e c u te IN S T (P C )
F e tc h IN S T (P C + 2 ) E x e c u te IN S T (P C + 1 )
Execution Flow
Mode Initial reset Skip Loading PCL Jump, call branch Return from subroutine
Program Counter *9 0 *9 #9 S9 *8 0 *8 #8 S8 *7 0 @7 #7 S7 *6 0 @6 #6 S6 *5 0 @5 #5 S5 *4 0 @4 #4 S4 *3 0 @3 #3 S3 *2 0 @2 #2 S2 *1 0 @1 #1 S1 *0 0 @0 #0 S0
Program Counter + 2
Program Counter Note: *9~*0: Program counter bits #9~#0: Instruction code bits S9~S0: Stack register bits @7~@0: PCL bits
Rev.1.10
6
June 10, 2010
HT48RA0-5
Program Memory - ROM The program memory is used to store the program instructions which are to be executed. It also contains data and table and is organized into 102414 bits, addressed by the program counter and table pointer. Certain locations in the program memory are reserved for special usage:
* Location 000H
000H D e v ic e in itia liz a tio n p r o g r a m
n00H L o o k - u p ta b le ( 2 5 6 w o r d s ) nFFH P ro g ra m
This area is reserved for the initialization program. After a device reset, the program always begins execution at location 000H.
* Table location
3FFH
L o o k - u p ta b le ( 2 5 6 w o r d s ) 1 4 b its
Any location in the Program Memory space can be used as a look-up table. The instructions TABRDC [m] (the current page, one page=256 words) and TABRDL [m] (the last page) transfer the contents of the lower-order byte to the specified data memory register, and the higher-order byte to TBLH (08H). Only the destination of the lower-order byte in the table is well-defined, the other bits of the table word are transferred to the lower portion of TBLH, the remaining 2 bits are read as 0. The Table Higher-order byte register (TBLH) is read only. The table pointer (TBLP) is a read/write register (07H), where P indicates the table location. Before accessing the table, the location must be placed in TBLP. The TBLH is read only and cannot be restored. All table related instructions need 2 cycles to complete the operation. These areas may function as normal program memory depending upon the requirements. Stack Register - STACK This is a special part of the memory used to save the contents of the program counter only. The stack is organized into one level and is neither part of the data nor part of the program space, and is neither readable nor writeable. The activated level is indexed by the stack pointer and is neither readable nor writeable. At a subroutine call the contents of the program counter are pushed onto the stack. At the end of a subroutine signaled by a return instruction, RET, the program counter is restored to its previous value from the stack. After a chip reset, the SP will point to the top of the stack. If the stack is full and a CALL is subsequently executed, stack overflow occurs and the first entry will be lost and only the most recent return address is stored.
Program Memory Data Memory - RAM The data memory is divided into two functional groups: special function registers and general purpose data memory (328). Most are read/write, but some are read only. The remaining space before the 20H is reserved for future expanded usage and reading these locations will return the result 00H. The general purpose data memory, addressed from 20H to 3FH, is used for data and control information under instruction command. All data memory areas can handle arithmetic, logic, increment, decrement and rotate operations directly. Except for some dedicated bits, each bit in the data memory can be set and reset by the SET [m].i and CLR [m].i instructions, respectively. They are also indirectly accessible through memory pointer register (MP;01H). Indirect Addressing Register Location 00H is an indirect addressing register that is not physically implemented. Any read/write operation to [00H] accesses the data memory pointed to by MP (01H). Reading location 00H itself indirectly will return the result 00H. Writing indirectly results in no operation. The memory pointer register MP (01H) is a 7-bit register. Bit 7 of MP is undefined and reading will return the result 1. Any writing operation to MP will only transfer the lower 7-bits of data to MP.
Table Location Instruction(s) *9 TABRDC [m] TABRDL [m] P9 1 *8 P8 1 *7 @7 @7 *6 @6 @6 *5 @5 @5 *4 @4 @4 *3 @3 @3 *2 @2 @2 *1 @1 @1 *0 @0 @0
Table Location Note: *9~*0: Table location bits P9~P8: Current program counter bits 7 @7~@0: Table pointer bits
Rev.1.10
June 10, 2010
HT48RA0-5
00H 01H 02H 03H 04H 05H 06H 07H 08H 09H 0AH 0BH 0CH 0DH 0EH 0FH 10H 11H 12H 13H 14H 15H 16H 17H 18H 19H 1AH 1BH 1CH 1DH 1EH 1FH 20H G e n e ra l P u rp o s e D a ta M e m o ry (3 2 B y te s ) TSR0 TSR1 CARL0 CARL1 CARH0 CARH1 :U nused R e a d a s "0 0 " PC PB PA S p e c ia l P u r p o s e D a ta M e m o ry STATUS ACC PCL TBLP TBLH IA R MP
Accumulator The accumulator closely relates to ALU operations. It is also mapped to location 05H of the data memory and is capable of carrying out immediate data operations. Data movement between two data memory locations has to pass through the accumulator. Arithmetic and Logic Unit - ALU This circuit performs 8-bit arithmetic and logic operation. The ALU provides the following functions.
* Arithmetic operations (ADD, ADC, SUB, SBC, DAA) * Logic operations (AND, OR, XOR, CPL) * Rotation (RL, RR, RLC, RRC) * Increment and Decrement (INC, DEC) * Branch decision (SZ, SNZ, SIZ, SDZ ....)
The ALU not only saves the results of a data operation but also changes the contents of the status register. Status Register - STATUS This 8-bit status register (0AH) contains the zero flag (Z), carry flag (C), auxiliary carry flag (AC), overflow flag (OV), power down flag (PDF) and watchdog time-out flag (TO). It also records the status information and controls the operation sequence. With the exception of the TO and PDF flags, the other status register bits can be altered by instructions like most other register. Any data written into the status register will not change the TO or PDF flags. In addition it should be noted that operations related to the status register may give different results from those intended. The TO and PDF flags can only be changed by the Watchdog Timer overflow, device power-up, clearing the Watchdog Timer and executing the HALT instruction. The Z, OV, AC and C flags generally reflect the status of the latest operations.
3FH
RAM Mapping
Bit No. 0
Label C
Function C is set if the operation results in a carry during an addition operation or if a borrow does not take place during a subtraction operation; otherwise C is cleared. C is also affected by a rotate through carry instruction. AC is set if the operation results in a carry out of the low nibbles in addition or no borrow from the high nibble into the low nibble in subtraction; otherwise AC is cleared. Z is set if the result of an arithmetic or logic operation is zero; otherwise Z is cleared. OV is set if the operation results in a carry into the highest-order bit but not a carry out of the highest-order bit, or vice versa; otherwise OV is cleared. PDF is cleared when either a system power-up or executing the CLR WDT instruction. PDF is set by executing the HALT instruction. TO is cleared by a system power-up or executing the CLR WDT or HALT instruction. TO is set by a WDT time-out. Unused bit, read as 0 Status (0AH) Register
1 2 3 4 5 6~7
AC Z OV PDF TO 3/4
Rev.1.10
8
June 10, 2010
HT48RA0-5
In addition, on executing a subroutine call, the status register will not be automatically pushed onto the stack. If the contents of the status are important and if the subroutine can corrupt the status register, precautions must be taken to save it properly. Oscillator Configuration In this device there are two methods of generating the system clock, one external crystal oscillator and one internal RC oscillator.
* External Crystal/Resonator Oscillator - HXT
Crystal Oscillator C1 and C2 Values Crystal Frequency 4MHz Note: C1 8pF C2 10pF
C1 and C2 values are for guidance only.
Crystal Recommended Capacitor Values
* Internal RC Oscillator - HIRC
The External Crystal/Ceramic System Oscillator is one of the system oscillator choices, which is selected via a configuration option. For the crystal oscillator configuration, the connection of a crystal across OSC1 and OSC2 will create the necessary phase shift and feedback for oscillation. Two external capacitors may be required to be connected as shown. However, the feedback resistor named Rf shown in the following diagram for the crystal oscillator to oscillate properly can be selected as either an internally or externally connected type via a configuration option. When the external connection type of the feedback resistor is selected, the recommended value of the external connected feedback resistor ranges from 300kW to 500kW. Using a ceramic resonator will usually require two small value capacitors, C1 and C2, to be connected as shown for oscillation to occur. The values of C1 and C2 should be selected in consultation with the crystal or resonator manufacturers specification.
C1 Rp OSC1 Rf In te r n a l O s c illa to r C ir c u it
The internal RC oscillator is a fully integrated system oscillator requiring no external components. The internal RC oscillator has a fixed frequency of 4095kHz. Device trimming during the manufacturing process and the inclusion of internal frequency compensation circuits are used to ensure that the influence of the power supply voltage, temperature and process variations on the oscillation frequency are minimised. As a result, at a power supply ranging from 1.8V to 3.6V and in a temperature range from -20C to 50C degrees, the fixed oscillation frequency of 4095kHz will have a tolerance within 2%. Note that if this internal system clock option is selected, as it requires no external pins for its operation, I/O pins PB5 and PB6 are free for use as normal I/O pins.
C2
OSC2
T o in te r n a l c ir c u its
N o te : 1 . R p is n o r m a lly n o t r e q u ir e d . C 1 a n d C 2 a r e r e q u ir e d . 2 . A lth o u g h n o t s h o w n O S C 1 /O S C 2 p in s h a v e a p a r a s itic c a p a c ita n c e o f a r o u n d 7 p F .
Crystal/Resonator Oscillator - HXT
Rev.1.10
9
June 10, 2010
HT48RA0-5
Watchdog Timer - WDT The WDT clock source is implemented by the instruction clock which is the system clock divided by 4 or the internal RC oscillator with the frequency of 12kHz. The clock source is processed by a frequency divider and a prescaler to provide various time out periods. Clock Source WDT time out period = 2n Where n= 8~11 selected by a configuration option. The WDT timer is designed to prevent a software malfunction or sequence jumping to an unknown location with unpredictable results. The Watchdog Timer can be disabled by configuration option. If the Watchdog Timer is disabled, all the executions related to the WDT result in no operation and the WDT will lose its protection purpose. In this situation the logic can only be restarted by external logic. A WDT overflow under normal operation will initialise a chip reset and set the status bit TO. To clear the contents of the WDT prescaler, two methods are adopted, software instructions or a HALT instruction. There are two types of software instructions. One type is the single instruction CLR WDT, the other type comprises two instructions, CLR WDT1 and CLR WDT2. Of these two types of instructions, only one can be active depending on the configuration option - CLR WDT times selection option. If the CLR WDT is selected (i.e.. CLR WDT times equal one), any execution of the CLR WDT instruction will clear the WDT. In case CLR WDT1 and CLR WDT2 are chosen (i.e.. CLR WDT times equal two), these two instructions must be executed to clear the WDT; otherwise, the WDT may reset the chip due to a time-out. Power Down Operation - HALT The Power-down mode is initialised by the HALT instruction and results in the following:
* The system oscillator turns off and the WDT stops. * The contents of the on-chip Data Memory and regis-
ters remain unchanged.
* WDT prescaler is cleared. * All I/O ports maintain their original status. * The PDF flag is set and the TO flag is cleared.
The system can quit the HALT mode by means of an external falling edge signal on port B. By examining the TO and PDF flags, the reason for chip reset can be determined. The PDF flag is cleared when the system powers up or when a CLR WDT instruction is executed and is set when the HALT instruction is executed. The TO flag is set if the WDT time-out occurs during normal operation. The port B wake-up can be considered as a continuation of normal execution. Each bit in port B can be independently selected to wake up the device by the code option. Awakening from an I/O port stimulus, the program will resume execution of the next instruction. Once a wake-up event(s) occurs, it takes 1024 tSYS (system clock periods) to resume normal operation. In other words, a dummy cycle period will be inserted after the wake-up. To minimize power consumption, all I/O pins should be carefully managed before entering the HALT status.
C le a r W D T fS /4
YS
W DT OSC (1 2 K R C )
MUX
fS
3 - b it C o u n te r F r e q u e n c y D iv id e r
P r e s c a lle r ( 8 - b it)
C o n fig u r a tio n O p tio n
S e le c to r
C o n fig u r a tio n O p tio n (n = 8 ~ 1 1 )
W D T T im e - o u t, 2
fS
n
Watchdog Timer
Rev.1.10
10
June 10, 2010
HT48RA0-5
Reset There are several ways in which a reset can occur:
* Power On reset * RES pin reset * Low Voltage reset * WDT time-out reset during normal operation
To guarantee that the system oscillator has started and stabilized, the SST (System Start-up Timer) provides an extra-delay of 1024 system clock pulses when the system powers up or when the system awakes from a HALT state. When a system power up occurs, an SST delay is added during the reset period. Any wake-up from HALT will enable the SST delay. The functional unit chip reset status is shown below. Program Counter WDT Prescaler Input/Output ports Stack Pointer Carrier output 000H Clear Input mode Points to the top of the stack Low level state or floating state*
Some registers remain unchanged during reset conditions. Most registers are reset to the initial condition when the reset conditions are met. By examining the PDF and TO flags, the program can distinguish between different chip resets. TO 0 u 1 1 PDF 0 u u 1 RESET Conditions Power-on reset RES or LVR reset during normal operation WDT time-out reset during normal operation WDT time-out reset during power-down mode
* Determined by configuration option
Note: u means unchanged.
VDD
V 0 .0 1 m F * *
tR
STD
DD
P o w e r-o n R e s e t
VDD 10kW ~ 100kW R E S /P C 0
1N4148*
S S T T im e - o u t In te rn a l R e s e t
Reset Timing Chart
0 .1 ~ 1 m F
300W *
VSS
HALT W DT LVR SST 1 0 -s ta g e R ip p le C o u n te r P o w e r - o n D e te c tio n C o ld R e s e t
Note:
* It is recommended that this component is added for added ESD protection ** It is recommended that this component is added in environments where power line noise is significant. External RES Circuit
OSC1
Reset Configuration
Rev.1.10
11
June 10, 2010
HT48RA0-5
The chip reset status of the registers is summarised in the following table: Register Program Counter MP ACC TBLP TBLH STATUS PA PB PC TSR0 TSR1 CARL0 CARL1 CARH0 CARH1 Note: Reset (Power On) 000H -xxx xxxx xxxx xxxx xxxx xxxx --xx xxxx --00 xxxx 1111 1111 1111 1111 ---- ---1 0000 0000 1000 0000 0000 0000 0000 0000 0000 0000 0000 0010 RES or LVR Reset 000H -uuu uuuu uuuu uuuu uuuu uuuu --uu uuuu --uu uuuu 1111 1111 1111 1111 ---- ---1 0000 0000 1000 0000 0000 0000 0000 0000 0000 0000 0000 0010 WDT Time-out (Normal Operation) 000H -uuu uuuu uuuu uuuu uuuu uuuu --uu uuuu --1u uuuu 1111 1111 1111 1111 ---- ---1 0000 0000 1000 0000 0000 0000 0000 0000 0000 0000 0000 0010 WDT Time-out (HALT)* 000H -uuu uuuu uuuu uuuu uuuu uuuu --uu uuuu --11 uuuu uuuu uuuu uuuu uuuu ---- ---u uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu
u means unchanged x means unknown - stands for unimplemented
Input/Output Ports There are up to 17 bidirectional input/output lines in the device, labeled PA, PB and PC which are mapped to [12H], [14H] and [16H] of the Data Memory, respectively. Each line of PA and PB can be selected as NMOS output or Schmitt trigger input with pull-high resistor by a software instruction. PC0 can be used as an input line with Schmitt trigger but without pull-high resistor or as the external RES pin determined by the configuration option. When the I/O ports are used for input operation, these ports are non-latched, that is, the inputs should be ready at the T2 rising edge of the instruction MOV A, [m] (m=12H, 14H or 16H). For I/O ports output operations, all data is latched and remains unchanged until the output latch is rewritten. When the I/O Ports are used for input operations, it should be noted that before reading data from the pads,
a 1 should be written to the related bits to disable the NMOS device. That is, the instruction SET [m].i (i=0~7 for PA and PB, i=0 for PC) is executed first to disable related NMOS device, and then MOV A, [m] to get stable data. After chip reset, the I/O Ports remain at a high level input line. Each bit of the I/O ports output latches can be set or cleared by the SET [m].i and CLR [m].i (m=12H, 14H or 16H) instructions respectively. Some instructions first input data and then follow the output operations. For example, SET [m].i, CLR [m], CPL [m] and CPLA [m] read the entire port states into the CPU, execute the defined operations (bit-operation), and then write the results back to the latches or to the accumulator. Each line of the I/O ports has a wake-up capability when the relevant pin is configured as an input line.
Rev.1.10
12
June 10, 2010
HT48RA0-5
V
DD
D a ta b u s D W r ite C h ip R e s e t R e a d D a ta R e g is te r S y s te m W a k e -u p (P A , P B )
Q CK S Q
W eak P u ll- u p PA0~PA7 PB0~PB1
PA and PB Input/Output Ports
D a ta b u s D CK S Q W r ite C h ip R e s e t R e a d D a ta R e g is te r S y s te m W a k e -u p (P C 0 ) P C 0 /R E S Q
PC0 Input/Output Port
V
DD
C o n fig u r a tio n O p tio n REM O u tp u t REM
REM output pin structure Timer The timer is an internal unit for creating a remote control transmission pattern. As shown, it consists of a 9-bit down counter (t8 to t0), a flag (t9) permitting the 1-bit timer output, and a zero detector. No. 0~7 Label t0~t7 Function Down counter Timer Operation The timer starts counting down when a value other than 0 is set for the down counter with a timer manipulation instruction. The timer manipulation instructions for making the timer start operation are shown below: MOV A,XXH MOV TSR0,A MOV A,XXH MOV TSR1,A SET TSR1.1 ; XX = 00H ~ FFH ; XX 01H, t8 ; The timer is started by set t9=1
TSR0 (18H) Register No. 0 1 2~6 7 Label t8 t9 3/4 TOEF Function Down counter Timer enable, initial value is 0. Unused bit, read as 0. Timer operation end flag, initial value is 1.
Addition notes for the 9-bit timer:
* Writing to TSR0 will only put the written data to the
TSR0 register (t7~t0) and writing to TSR1 (t8) will transfer the specified data and contents of TSR0 to the Down Counter. TOEF will be cleared after the data transferred from TSR1 and TSR0 to the Down Counter is completed and then wait until TSR1.1 is set by user.
* Setting TSR1.1=1, the timer will start counting. The
TSR1 (19H) Register
timer will stop when its count is equal to 0 and then TOEF is set equal to 1. Rev.1.10 13 June 10, 2010
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* If the TSR1.1 is cleared during the timer counting, the
In the case above, the timer output time is as follows. (Set value+1) 64/fSYS = (511+1) 16ms = 8.192ms
T im e r O u tp u t 8 .1 9 2 m s
timer will be stopped. Once the TSR1.1 is set (1(R)0(R)1), the down counter will reload data from t8~t0, and then the down counter begins counting down with the new load data.
* If TSR1.1 and TOEF are equal to 1 both, the timer can
re-start, after new data is written to TSR0, TSR1 (t0~t8) in sequence. Note: If the contents of the Down counter is 000H, set the t9 to start the timer counting, the timer will o n l y c o u n t 1 s t ep. Th e t i m er o u t p u t time=64/fSYS. (R) [ (0+1) 64/fSYS=64/fSYS]
The down counter is decremented (-1) in the cycle of 64/fSYS. If the value of the down counter becomes 0, the zero detector generates the timer operation end signal to stop the timer operation. At this time, TOEF will be set to 1. The output of the timer operation end signal is continued while the down counter is 0 and the timer is stopped. The following relational expression applies between the timers output time and the down counters set value. Timer output time = (Set value+1) 64/fSYS An example is shown below. MOV A,0FFH MOV TSR0,A MOV A,01H MOV TSR1,A SET TSR1.1
Setting the t9 bit channels the timer to the REM pin. The REM pin will be a combination of the timer and carrier signals. Note: The carrier output results if bit 9 of the high-level period setting modulo register (CARH) is cleared (0).
T im e r O u tp u t
T im e r O u tp u t T im e : ( S e t v a lu e + 1 ) x 6 4 /fS
YS
Timer Output when Carrier is not Output
tS t9
R1
tS t8 t7 t6 t5 t4
R0
t3
t2
t1
t0 fS t9 /6 4
D o w n C o u n te r, (t8 ~ t0 )+ 1 C o n fig u r a tio n O p tio n Z e ro D e te c to r R E M /R E M D R V O u tp u t C o n tro l C ir c u it
Count C lo c k
YS
TOEF
Timer Configuration
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Carrier Output
* Carrier output generator
The carrier generator consists of a 9-bit counter and two modulo registers for setting the high-level and low-level periods - CARH and CARL respectively. Register CARL0 CARL1 CARH0 CARH1 Bit7 CL.7 3/4 CH.7 3/4 Bit6 CL. 3/4 CH.6 3/4 Bit5 CL. 3/4 CH.5 3/4 Bit4 CL. 3/4 CH.4 3/4 Bit3 CL.3 3/4 CH.3 3/4 Bit2 CL.2 3/4 CH.2 3/4 Bit1 CL.1 Fix 0 CH.1 CH.9 (CARY) Bit0 CL.0 CL.8 CH.0 CH.8
CARL0 (1AH) Register, CARL1 (1BH), CARH0 (1CH) Register, CARH1 (1DH), Register Note: 1. CARH1.1 (CARY) initial value is 1. 2. CARL1.2 (CARH1.2)~CARL1.7 (CARH1.7) are unused bits, read as 0. The carrier duty ratio and carrier frequency can be determined by setting the high-level and low-level widths using the respective modulo registers. Each of these widths can be set in a range of 500ns to 64ms at fSYS = 4MHz. CARH (CARH1.0, CARH0.7~CARH0.0) and CARL (CARL1.0, CARL0.7~CARL0.0) are read and written using instructions. Example: MOV MOV MOV MOV MOV MOV MOV MOV CLR A,XXH CARL0,A A,XXH CARL1,A A,XXH CARH0,A A,XXH CARH1,A CARH1.1 ; XXH = 00H~FFH ; XXH 01H, CL.8 (CARL1.0) ; XXH = 00H~FFH ; XXH 02H, CH.8 (CARH1.0) ; The carrier is started by clearing CARY(CARH1.1)=0
CARH CARH1 C a r r ie r S ig n a l C H .9 CARY C H .8 C H .7 C H .6 C H .5 CARH0 C H .4 C H .3 C H .2 C H .1 C H .0 CARL1 C L .9 (0 ) N o te 1 . C L .8 C L .7 C L .6
CARL CARL0 C L .5 C L .4 C L .3 C L .2 C L .1 C L .0
M o d u lo r e g is te r fo r s e ttin g th e h ig h - le v e l p e r io d (C A R H .8 ~ C A R H .0 )
M o d u lo r e g is te r fo r s e ttin g th e lo w - le v e l p e r io d (C A R L .8 ~ C A R L .0 )
S e le c to r
F /F
M a tc h
C o m p a ra to r
C le a r
9 - b it C o u n te r
fS
YS
t9 (N o te 2 ) fS
YS
Configuration of Remote Controller Carrier Generator Note: 1. Bit 9 of the modulo register for setting the low-level period (CARL) is fixed to 0. 2. t9: Flag that enables timer output (timer block, see Timer Configuration)
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The values of CARH and CARL can be calculated from the following expressions. CARL (CARL1.0, CARL0.7~CARL0.0) = ( fSYS (1-D) T) - 1 CARH (CARH1.0, CARH0.7~CARH0.0) = ( fSYS D T) - 1 D: Carrier duty ratio (0 < D < 1) fSYS: Input clock (MHz) T: Carrier cycle (ms) Ensure to input values in the range of 001H to 1FFH to CARL and CARH. Example: fSYS = 4MHz, fc = 38.1kHz, T = 1/ fc = 26.25ms, duty = 1/3 CARL = (4M (1-1/3) 26.25ms) - 1 = 69 = 45H CARH = (4M 1/3 26.25ms) - 1 = 34 = 22H MOV MOV MOV MOV CLR A,045H CARL0,A A,022H CARH0,A CARH1.1 ; The carrier is started by clearing CARY(CARH1.1) = 0
* Carrier output control
The remote controller carrier can be output from the REM pin by clearing to zero bit 9 (CARY) of the modulo register for setting the high-level period (CARH). When performing a carrier output, be sure to set the timer operation after setting the CARH (CARH1.0, CARH0.7~CARH0.0) and CARL (CARL1.0, CARL0.7~CARL0.0) values. Note that a malfunction may occur if the values of CARH (CARH1.0, CARH0.7~CARH0.0) and CARL (CARL1.0, CARL0.7~CARL0.0) are changed while the carrier is being output on the REM pin. Executing the timer manipulation instruction starts the carrier output from the low level. There is a dual function remote controller carrier output pin named REM. The selection of REM or REMDRV is determined by a configuration option. After a reset, the REM carrier output pin will have a low level while the REMDRV carrier output pin will be in a floating condition. The generic structures of the REM or REMDRV function are illustrated in the accompanying diagram. As the exact construction of the carrier output pin will differ from these drawings, they are supplied as a guide only to assist with the functional understanding of the remote carrier output pins. The output from the REM pin is in accordance with the value of bit 9 (CARY) of CARH and the timer output enable flag (t9), and the value of the timer 9-bit down counter (t0 to t8).
T im e r O u tp u t T im e : ( S e t v a lu e + 1 ) x 6 4 /fS Y
S
T im e r O u tp u t
C a r r ie r tL tH
S e e N o te
Timer Output when Carrier is Output Note: When the carrier signal is active and during the time when the signal is high, if the timer output should go low, the carrier signal will first complete its high level period before going low.
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CARH1.1 0 0 0 0 1 1 Timer Output Enable Flag (t9: TSR1.1) 0 0 1 1 0 1 9-bit Down Counter 0 Low-level output Other than 0 0 Other than 0 3/4 3/4 64/fSYS (with carrier output) Carrier output (Note) Low-level output High-level output 64/fSYS (with carrier output) Carrier output Floating output Low-level output Floating output REM Function (CMOS Output) REMDRV Function (NMOS Output)
REM Pin Output Control Note: Input values in the range of 001H to 1FFH to CARH (CARH1.0, CARH0.7~CARH0.0) and CARL (CARL1.0, CARL0.7~CARL0.0). Caution: CARH (CARH1.0, CARH0.7~CARH0.0) and CARL (CARL1.0, CARL0.7~CARL0.0) must be set while the REM pin is at a low level (t9 = 0 or t0 to t8 = 0). CARH (CARH1.0, CARH0.7~CARH0.0) 01H 03H 09H 13H 20H 21H 22H 22H 22H 23H 24H 34H 3BH 63H 7FH CARL (CARL1.0, CARL0.7~CARL0.0) 01H 05H 09H 13H 20H 41H 44H 45H 46H 48H 49H 6AH 3BH 63H 7FH
tH (ms) 0.50 1.00 2.50 5.00 8.25 8.25 8.75 8.75 8.80 9.00 9.26 13.33 15.00 25.00 32.00
tL (ms) 0.50 1.50 2.50 5.00 8.25 16.75 17.25 17.50 17.60 18.25 18.52 26.66 15.00 25.00 32.00
t (ms) 1.00 2.50 5.00 10.00 16.50 25.00 26.00 26.25 26.40 27.25 27.78 40.00 30.00 50.00 64.00
fC (kHz) 1000 400 200 100 60.60 40.00 38.50 38.10 37.90 36.70 36.00 25.00 33.30 20.00 15.60
Duty 1/2 2/5 1/2 1/2 1/2 1/3 1/3 1/3 1/3 1/3 1/3 1/3 1/2 1/2 1/2
Carrier Frequency Setting (fSYS=4MHz)
tL tH C a r r ie r S ig n a l t
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Low Voltage Reset - LVR The microcontroller provides a low voltage reset circuit in order to monitor the supply voltage of the device. If the supply voltage of the device is within the range 0.9V~VLVR, such as when changing a battery, the LVR will automatically reset the device internally. The LVR includes the following specifications:
V 1 .9 V
* The low voltage (0.9V~VLVR) has to remain in this
The relationship between VDD and VLVR is shown below.
VDD 3 .6 V
LVR
state for a time in excess of 1ms. If the low voltage state does not exceed 1ms, the LVR will ignore it and will not perform a reset function.
0 .9 V
V 3 .6 V
DD
V
LVR
L V R D e te c t V o lta g e
0 .9 V 0V R e s e t S ig n a l
R eset *1
N o r m a l O p e r a tio n *2
R eset
Low Voltage Reset Note: *1 To make sure that the system oscillator has stabilised, the SST provides an extra delay of 1024 system clock pulses before entering normal operation. *2 Since low voltage has to be maintained in its original state and exceed 1ms, a 1ms delay enters the reset mode.
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Configuration Options The following table shows the range of configuration options for the device. All the configuration options must be defined to ensure proper system functioning. No. Oscillator Options System oscillator selection - fSYS: XTAL oscillator without internal feedback resistor XTAL oscillator with internal feedback resistor Internal 4095kHz RC oscillator Code Option
1
REM Pin Options 2 REM or REMDRV output function selection
Watchdog Options 3 4 5 6 WDT clock selection - fS: Internal RC oscillator or fSYS/4 WDT function: enable or disable CLRWDT instruction selections: 1 or 2 instructions WDT time-out period selections: 28/fS, 29/fS, 210/fS, 211/fS
LVR Options 7 LVR function: enable or disable
Reset Pin Options 8 I/O or RES pin selection
Application Circuits
V 0 .0 1 m F * *
DD
VDD Reset C ir c u it RES PA0~PA7 PB0~PB4 VSS PB7 REM
0 .1 m F
1N4148*
10kW ~ 100kW 300W *
0 .1 ~ 1 m F
OSC C ir c u it S e e O s c illa to r S e c tio n
OSC1 OSC2
Note:
* It is recommended that this component is added for added ESD protection. ** It is recommended that this component is added in environments where power line noise is significant.
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Example
PB1 PB0 PA3 PA2 PA1 PA0 V
DD
PB2 PB3 PB4 PB5 PB6 PB7
VDD 10mF
PA7 PA6 PA5
VSS
PA4
Note:
* The 0.1mF capacitor is required to ensure that the system clock frequency meets with the specified tolerance in the A.C. Characteristics.
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Instruction Set
Introduction C e n t ra l t o t he s uc c es s f ul oper a t i on o f a n y microcontroller is its instruction set, which is a set of program instruction codes that directs the microcontroller to perform certain operations. In the case of Holtek microcontrollers, a comprehensive and flexible set of over 60 instructions is provided to enable programmers to implement their application with the minimum of programming overheads. For easier understanding of the various instruction codes, they have been subdivided into several functional groupings. Instruction Timing Most instructions are implemented within one instruction cycle. The exceptions to this are branch, call, or table read instructions where two instruction cycles are required. One instruction cycle is equal to 4 system clock cycles, therefore in the case of an 8MHz system oscillator, most instructions would be implemented within 0.5ms and branch or call instructions would be implemented within 1ms. Although instructions which require one more cycle to implement are generally limited to the JMP, CALL, RET, RETI and table read instructions, it is important to realize that any other instructions which involve manipulation of the Program Counter Low register or PCL will also take one more cycle to implement. As instructions which change the contents of the PCL will imply a direct jump to that new address, one more cycle will be required. Examples of such instructions would be CLR PCL or MOV PCL, A. For the case of skip instructions, it must be noted that if the result of the comparison involves a skip operation then this will also take one more cycle, if no skip is involved then only one cycle is required. Moving and Transferring Data The transfer of data within the microcontroller program is one of the most frequently used operations. Making use of three kinds of MOV instructions, data can be transferred from registers to the Accumulator and vice-versa as well as being able to move specific immediate data directly into the Accumulator. One of the most important data transfer applications is to receive data from the input ports and transfer data to the output ports. Arithmetic Operations The ability to perform certain arithmetic operations and data manipulation is a necessary feature of most microcontroller applications. Within the Holtek microcontroller instruction set are a range of add and subtract instruction mnemonics to enable the necessary arithmetic to be carried out. Care must be taken to ensure correct handling of carry and borrow data when results exceed 255 for addition and less than 0 for subtraction. The increment and decrement instructions INC, INCA, DEC and DECA provide a simple means of increasing or decreasing by a value of one of the values in the destination specified. Logical and Rotate Operations The standard logical operations such as AND, OR, XOR and CPL all have their own instruction within the Holtek microcontroller instruction set. As with the case of most instructions involving data manipulation, data must pass through the Accumulator which may involve additional programming steps. In all logical data operations, the zero flag may be set if the result of the operation is zero. Another form of logical data manipulation comes from the rotate instructions such as RR, RL, RRC and RLC which provide a simple means of rotating one bit right or left. Different rotate instructions exist depending on program requirements. Rotate instructions are useful for serial port programming applications where data can be rotated from an internal register into the Carry bit from where it can be examined and the necessary serial bit set high or low. Another application where rotate data operations are used is to implement multiplication and division calculations. Branches and Control Transfer Program branching takes the form of either jumps to specified locations using the JMP instruction or to a subroutine using the CALL instruction. They differ in the sense that in the case of a subroutine call, the program must return to the instruction immediately when the subroutine has been carried out. This is done by placing a return instruction RET in the subroutine which will cause the program to jump back to the address right after the CALL instruction. In the case of a JMP instruction, the program simply jumps to the desired location. There is no requirement to jump back to the original jumping off point as in the case of the CALL instruction. One special and extremely useful set of branch instructions are the conditional branches. Here a decision is first made regarding the condition of a certain data memory or individual bits. Depending upon the conditions, the program will continue with the next instruction or skip over it and jump to the following instruction. These instructions are the key to decision making and branching within the program perhaps determined by the condition of certain input switches or by the condition of internal data bits.
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Bit Operations The ability to provide single bit operations on Data Memory is an extremely flexible feature of all Holtek microcontrollers. This feature is especially useful for output port bit programming where individual bits or port pins can be directly set high or low using either the SET [m].i or CLR [m].i instructions respectively. The feature removes the need for programmers to first read the 8-bit output port, manipulate the input data to ensure that other bits are not changed and then output the port with the correct new data. This read-modify-write process is taken care of automatically when these bit operation instructions are used. Table Read Operations Data storage is normally implemented by using registers. However, when working with large amounts of fixed data, the volume involved often makes it inconvenient to store the fixed data in the Data Memory. To overcome this problem, Holtek microcontrollers allow an area of Program Memory to be setup as a table where data can be directly stored. A set of easy to use instructions provides the means by which this fixed data can be referenced and retrieved from the Program Memory. Other Operations In addition to the above functional instructions, a range of other instructions also exist such as the HALT instruction for Power-down operations and instructions to control the operation of the Watchdog Timer for reliable program operations under extreme electric or electromagnetic environments. For their relevant operations, refer to the functional related sections. Instruction Set Summary The following table depicts a summary of the instruction set categorised according to function and can be consulted as a basic instruction reference using the following listed conventions. Table conventions: x: Bits immediate data m: Data Memory address A: Accumulator i: 0~7 number of bits addr: Program memory address
Mnemonic Arithmetic ADD A,[m] ADDM A,[m] ADD A,x ADC A,[m] ADCM A,[m] SUB A,x SUB A,[m] SUBM A,[m] SBC A,[m] SBCM A,[m] DAA [m] AND A,[m] OR A,[m] XOR A,[m] ANDM A,[m] ORM A,[m] XORM A,[m] AND A,x OR A,x XOR A,x CPL [m] CPLA [m] INCA [m] INC [m] DECA [m] DEC [m]
Description Add Data Memory to ACC Add ACC to Data Memory Add immediate data to ACC Add Data Memory to ACC with Carry Add ACC to Data memory with Carry Subtract immediate data from the ACC Subtract Data Memory from ACC Subtract Data Memory from ACC with result in Data Memory Subtract Data Memory from ACC with Carry Subtract Data Memory from ACC with Carry, result in Data Memory Decimal adjust ACC for Addition with result in Data Memory Logical AND Data Memory to ACC Logical OR Data Memory to ACC Logical XOR Data Memory to ACC Logical AND ACC to Data Memory Logical OR ACC to Data Memory Logical XOR ACC to Data Memory Logical AND immediate Data to ACC Logical OR immediate Data to ACC Logical XOR immediate Data to ACC Complement Data Memory Complement Data Memory with result in ACC Increment Data Memory with result in ACC Increment Data Memory Decrement Data Memory with result in ACC Decrement Data Memory
Cycles 1 1Note 1 1 1Note 1 1 1Note 1 1Note 1Note 1 1 1 1Note 1Note 1Note 1 1 1 1Note 1 1 1Note 1 1Note
Flag Affected Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV C Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z
Logic Operation
Increment & Decrement
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Mnemonic Rotate RRA [m] RR [m] RRCA [m] RRC [m] RLA [m] RL [m] RLCA [m] RLC [m] Data Move MOV A,[m] MOV [m],A MOV A,x Bit Operation CLR [m].i SET [m].i Branch JMP addr SZ [m] SZA [m] SZ [m].i SNZ [m].i SIZ [m] SDZ [m] SIZA [m] SDZA [m] CALL addr RET RET A,x RETI Table Read TABRDC [m] TABRDL [m] Miscellaneous NOP CLR [m] SET [m] CLR WDT CLR WDT1 CLR WDT2 SWAP [m] SWAPA [m] HALT Note: No operation Clear Data Memory Set Data Memory Clear Watchdog Timer Pre-clear Watchdog Timer Pre-clear Watchdog Timer Swap nibbles of Data Memory Swap nibbles of Data Memory with result in ACC Enter power down mode 1 1Note 1Note 1 1 1 1Note 1 1 None None None TO, PDF TO, PDF TO, PDF None None TO, PDF Read table (current page) to TBLH and Data Memory Read table (last page) to TBLH and Data Memory 2Note 2Note None None Jump unconditionally Skip if Data Memory is zero Skip if Data Memory is zero with data movement to ACC Skip if bit i of Data Memory is zero Skip if bit i of Data Memory is not zero Skip if increment Data Memory is zero Skip if decrement Data Memory is zero Skip if increment Data Memory is zero with result in ACC Skip if decrement Data Memory is zero with result in ACC Subroutine call Return from subroutine Return from subroutine and load immediate data to ACC Return from interrupt 2 1Note 1note 1Note 1Note 1Note 1Note 1Note 1Note 2 2 2 2 None None None None None None None None None None None None None Clear bit of Data Memory Set bit of Data Memory 1Note 1Note None None Move Data Memory to ACC Move ACC to Data Memory Move immediate data to ACC 1 1Note 1 None None None Rotate Data Memory right with result in ACC Rotate Data Memory right Rotate Data Memory right through Carry with result in ACC Rotate Data Memory right through Carry Rotate Data Memory left with result in ACC Rotate Data Memory left Rotate Data Memory left through Carry with result in ACC Rotate Data Memory left through Carry 1 1Note 1 1Note 1 1Note 1 1Note None None C C None None C C Description Cycles Flag Affected
1. For skip instructions, if the result of the comparison involves a skip then two cycles are required, if no skip takes place only one cycle is required. 2. Any instruction which changes the contents of the PCL will also require 2 cycles for execution. 3. For the CLR WDT1 and CLR WDT2 instructions the TO and PDF flags may be affected by the execution status. The TO and PDF flags are cleared after both CLR WDT1 and CLR WDT2 instructions are consecutively executed. Otherwise the TO and PDF flags remain unchanged.
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Instruction Definition
ADC A,[m] Description Operation Affected flag(s) ADCM A,[m] Description Operation Affected flag(s) ADD A,[m] Description Operation Affected flag(s) ADD A,x Description Operation Affected flag(s) ADDM A,[m] Description Operation Affected flag(s) AND A,[m] Description Operation Affected flag(s) AND A,x Description Operation Affected flag(s) ANDM A,[m] Description Operation Affected flag(s) Rev.1.10 Add Data Memory to ACC with Carry The contents of the specified Data Memory, Accumulator and the carry flag are added. The result is stored in the Accumulator. ACC ACC + [m] + C OV, Z, AC, C Add ACC to Data Memory with Carry The contents of the specified Data Memory, Accumulator and the carry flag are added. The result is stored in the specified Data Memory. [m] ACC + [m] + C OV, Z, AC, C Add Data Memory to ACC The contents of the specified Data Memory and the Accumulator are added. The result is stored in the Accumulator. ACC ACC + [m] OV, Z, AC, C Add immediate data to ACC The contents of the Accumulator and the specified immediate data are added. The result is stored in the Accumulator. ACC ACC + x OV, Z, AC, C Add ACC to Data Memory The contents of the specified Data Memory and the Accumulator are added. The result is stored in the specified Data Memory. [m] ACC + [m] OV, Z, AC, C Logical AND Data Memory to ACC Data in the Accumulator and the specified Data Memory perform a bitwise logical AND operation. The result is stored in the Accumulator. ACC ACC AND [m] Z Logical AND immediate data to ACC Data in the Accumulator and the specified immediate data perform a bitwise logical AND operation. The result is stored in the Accumulator. ACC ACC AND x Z Logical AND ACC to Data Memory Data in the specified Data Memory and the Accumulator perform a bitwise logical AND operation. The result is stored in the Data Memory. [m] ACC AND [m] Z 24 June 10, 2010
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CALL addr Description Subroutine call Unconditionally calls a subroutine at the specified address. The Program Counter then increments by 1 to obtain the address of the next instruction which is then pushed onto the stack. The specified address is then loaded and the program continues execution from this new address. As this instruction requires an additional operation, it is a two cycle instruction. Stack Program Counter + 1 Program Counter addr None Clear Data Memory Each bit of the specified Data Memory is cleared to 0. [m] 00H None Clear bit of Data Memory Bit i of the specified Data Memory is cleared to 0. [m].i 0 None Clear Watchdog Timer The TO, PDF flags and the WDT are all cleared. WDT cleared TO 0 PDF 0 TO, PDF Pre-clear Watchdog Timer The TO, PDF flags and the WDT are all cleared. Note that this instruction works in conjunction with CLR WDT2 and must be executed alternately with CLR WDT2 to have effect. Repetitively executing this instruction without alternately executing CLR WDT2 will have no effect. WDT cleared TO 0 PDF 0 TO, PDF Pre-clear Watchdog Timer The TO, PDF flags and the WDT are all cleared. Note that this instruction works in conjunction with CLR WDT1 and must be executed alternately with CLR WDT1 to have effect. Repetitively executing this instruction without alternately executing CLR WDT1 will have no effect. WDT cleared TO 0 PDF 0 TO, PDF
Operation
Affected flag(s) CLR [m] Description Operation Affected flag(s) CLR [m].i Description Operation Affected flag(s) CLR WDT Description Operation
Affected flag(s) CLR WDT1 Description
Operation
Affected flag(s) CLR WDT2 Description
Operation
Affected flag(s)
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CPL [m] Description Operation Affected flag(s) CPLA [m] Description Complement Data Memory Each bit of the specified Data Memory is logically complemented (1s complement). Bits which previously contained a 1 are changed to 0 and vice versa. [m] [m] Z Complement Data Memory with result in ACC Each bit of the specified Data Memory is logically complemented (1s complement). Bits which previously contained a 1 are changed to 0 and vice versa. The complemented result is stored in the Accumulator and the contents of the Data Memory remain unchanged. ACC [m] Z Decimal-Adjust ACC for addition with result in Data Memory Convert the contents of the Accumulator value to a BCD ( Binary Coded Decimal) value resulting from the previous addition of two BCD variables. If the low nibble is greater than 9 or if AC flag is set, then a value of 6 will be added to the low nibble. Otherwise the low nibble remains unchanged. If the high nibble is greater than 9 or if the C flag is set, then a value of 6 will be added to the high nibble. Essentially, the decimal conversion is performed by adding 00H, 06H, 60H or 66H depending on the Accumulator and flag conditions. Only the C flag may be affected by this instruction which indicates that if the original BCD sum is greater than 100, it allows multiple precision decimal addition. [m] ACC + 00H or [m] ACC + 06H or [m] ACC + 60H or [m] ACC + 66H C Decrement Data Memory Data in the specified Data Memory is decremented by 1. [m] [m] - 1 Z Decrement Data Memory with result in ACC Data in the specified Data Memory is decremented by 1. The result is stored in the Accumulator. The contents of the Data Memory remain unchanged. ACC [m] - 1 Z Enter power down mode This instruction stops the program execution and turns off the system clock. The contents of the Data Memory and registers are retained. The WDT and prescaler are cleared. The power down flag PDF is set and the WDT time-out flag TO is cleared. TO 0 PDF 1 TO, PDF
Operation Affected flag(s) DAA [m] Description
Operation
Affected flag(s) DEC [m] Description Operation Affected flag(s) DECA [m] Description Operation Affected flag(s) HALT Description
Operation
Affected flag(s)
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INC [m] Description Operation Affected flag(s) INCA [m] Description Operation Affected flag(s) JMP addr Description Increment Data Memory Data in the specified Data Memory is incremented by 1. [m] [m] + 1 Z Increment Data Memory with result in ACC Data in the specified Data Memory is incremented by 1. The result is stored in the Accumulator. The contents of the Data Memory remain unchanged. ACC [m] + 1 Z Jump unconditionally The contents of the Program Counter are replaced with the specified address. Program execution then continues from this new address. As this requires the insertion of a dummy instruction while the new address is loaded, it is a two cycle instruction. Program Counter addr None Move Data Memory to ACC The contents of the specified Data Memory are copied to the Accumulator. ACC [m] None Move immediate data to ACC The immediate data specified is loaded into the Accumulator. ACC x None Move ACC to Data Memory The contents of the Accumulator are copied to the specified Data Memory. [m] ACC None No operation No operation is performed. Execution continues with the next instruction. No operation None Logical OR Data Memory to ACC Data in the Accumulator and the specified Data Memory perform a bitwise logical OR operation. The result is stored in the Accumulator. ACC ACC OR [m] Z
Operation Affected flag(s) MOV A,[m] Description Operation Affected flag(s) MOV A,x Description Operation Affected flag(s) MOV [m],A Description Operation Affected flag(s) NOP Description Operation Affected flag(s) OR A,[m] Description Operation Affected flag(s)
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OR A,x Description Operation Affected flag(s) ORM A,[m] Description Operation Affected flag(s) RET Description Operation Affected flag(s) RET A,x Description Operation Logical OR immediate data to ACC Data in the Accumulator and the specified immediate data perform a bitwise logical OR operation. The result is stored in the Accumulator. ACC ACC OR x Z Logical OR ACC to Data Memory Data in the specified Data Memory and the Accumulator perform a bitwise logical OR operation. The result is stored in the Data Memory. [m] ACC OR [m] Z Return from subroutine The Program Counter is restored from the stack. Program execution continues at the restored address. Program Counter Stack None Return from subroutine and load immediate data to ACC The Program Counter is restored from the stack and the Accumulator loaded with the specified immediate data. Program execution continues at the restored address. Program Counter Stack ACC x None Return from interrupt The Program Counter is restored from the stack and the interrupts are re-enabled by setting the EMI bit. EMI is the master interrupt global enable bit. If an interrupt was pending when the RETI instruction is executed, the pending Interrupt routine will be processed before returning to the main program. Program Counter Stack EMI 1 None Rotate Data Memory left The contents of the specified Data Memory are rotated left by 1 bit with bit 7 rotated into bit 0. [m].(i+1) [m].i; (i = 0~6) [m].0 [m].7 None Rotate Data Memory left with result in ACC The contents of the specified Data Memory are rotated left by 1 bit with bit 7 rotated into bit 0. The rotated result is stored in the Accumulator and the contents of the Data Memory remain unchanged. ACC.(i+1) [m].i; (i = 0~6) ACC.0 [m].7 None
Affected flag(s) RETI Description
Operation
Affected flag(s) RL [m] Description Operation
Affected flag(s) RLA [m] Description
Operation
Affected flag(s)
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RLC [m] Description Operation Rotate Data Memory left through Carry The contents of the specified Data Memory and the carry flag are rotated left by 1 bit. Bit 7 replaces the Carry bit and the original carry flag is rotated into bit 0. [m].(i+1) [m].i; (i = 0~6) [m].0 C C [m].7 C Rotate Data Memory left through Carry with result in ACC Data in the specified Data Memory and the carry flag are rotated left by 1 bit. Bit 7 replaces the Carry bit and the original carry flag is rotated into the bit 0. The rotated result is stored in the Accumulator and the contents of the Data Memory remain unchanged. ACC.(i+1) [m].i; (i = 0~6) ACC.0 C C [m].7 C Rotate Data Memory right The contents of the specified Data Memory are rotated right by 1 bit with bit 0 rotated into bit 7. [m].i [m].(i+1); (i = 0~6) [m].7 [m].0 None Rotate Data Memory right with result in ACC Data in the specified Data Memory and the carry flag are rotated right by 1 bit with bit 0 rotated into bit 7. The rotated result is stored in the Accumulator and the contents of the Data Memory remain unchanged. ACC.i [m].(i+1); (i = 0~6) ACC.7 [m].0 None Rotate Data Memory right through Carry The contents of the specified Data Memory and the carry flag are rotated right by 1 bit. Bit 0 replaces the Carry bit and the original carry flag is rotated into bit 7. [m].i [m].(i+1); (i = 0~6) [m].7 C C [m].0 C Rotate Data Memory right through Carry with result in ACC Data in the specified Data Memory and the carry flag are rotated right by 1 bit. Bit 0 replaces the Carry bit and the original carry flag is rotated into bit 7. The rotated result is stored in the Accumulator and the contents of the Data Memory remain unchanged. ACC.i [m].(i+1); (i = 0~6) ACC.7 C C [m].0 C
Affected flag(s) RLCA [m] Description
Operation
Affected flag(s) RR [m] Description Operation
Affected flag(s) RRA [m] Description
Operation
Affected flag(s) RRC [m] Description Operation
Affected flag(s) RRCA [m] Description
Operation
Affected flag(s)
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SBC A,[m] Description Subtract Data Memory from ACC with Carry The contents of the specified Data Memory and the complement of the carry flag are subtracted from the Accumulator. The result is stored in the Accumulator. Note that if the result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1. ACC ACC - [m] - C OV, Z, AC, C Subtract Data Memory from ACC with Carry and result in Data Memory The contents of the specified Data Memory and the complement of the carry flag are subtracted from the Accumulator. The result is stored in the Data Memory. Note that if the result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1. [m] ACC - [m] - C OV, Z, AC, C Skip if decrement Data Memory is 0 The contents of the specified Data Memory are first decremented by 1. If the result is 0 the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program proceeds with the following instruction. [m] [m] - 1 Skip if [m] = 0 None Skip if decrement Data Memory is zero with result in ACC The contents of the specified Data Memory are first decremented by 1. If the result is 0, the following instruction is skipped. The result is stored in the Accumulator but the specified Data Memory contents remain unchanged. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0, the program proceeds with the following instruction. ACC [m] - 1 Skip if ACC = 0 None Set Data Memory Each bit of the specified Data Memory is set to 1. [m] FFH None Set bit of Data Memory Bit i of the specified Data Memory is set to 1. [m].i 1 None
Operation Affected flag(s) SBCM A,[m] Description
Operation Affected flag(s) SDZ [m] Description
Operation Affected flag(s) SDZA [m] Description
Operation
Affected flag(s) SET [m] Description Operation Affected flag(s) SET [m].i Description Operation Affected flag(s)
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SIZ [m] Description Skip if increment Data Memory is 0 The contents of the specified Data Memory are first incremented by 1. If the result is 0, the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program proceeds with the following instruction. [m] [m] + 1 Skip if [m] = 0 None Skip if increment Data Memory is zero with result in ACC The contents of the specified Data Memory are first incremented by 1. If the result is 0, the following instruction is skipped. The result is stored in the Accumulator but the specified Data Memory contents remain unchanged. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program proceeds with the following instruction. ACC [m] + 1 Skip if ACC = 0 None Skip if bit i of Data Memory is not 0 If bit i of the specified Data Memory is not 0, the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is 0 the program proceeds with the following instruction. Skip if [m].i 0 None Subtract Data Memory from ACC The specified Data Memory is subtracted from the contents of the Accumulator. The result is stored in the Accumulator. Note that if the result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1. ACC ACC - [m] OV, Z, AC, C Subtract Data Memory from ACC with result in Data Memory The specified Data Memory is subtracted from the contents of the Accumulator. The result is stored in the Data Memory. Note that if the result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1. [m] ACC - [m] OV, Z, AC, C Subtract immediate data from ACC The immediate data specified by the code is subtracted from the contents of the Accumulator. The result is stored in the Accumulator. Note that if the result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1. ACC ACC - x OV, Z, AC, C
Operation Affected flag(s) SIZA [m] Description
Operation Affected flag(s) SNZ [m].i Description
Operation Affected flag(s) SUB A,[m] Description
Operation Affected flag(s) SUBM A,[m] Description
Operation Affected flag(s) SUB A,x Description
Operation Affected flag(s)
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SWAP [m] Description Operation Affected flag(s) SWAPA [m] Description Operation Swap nibbles of Data Memory The low-order and high-order nibbles of the specified Data Memory are interchanged. [m].3~[m].0 [m].7 ~ [m].4 None Swap nibbles of Data Memory with result in ACC The low-order and high-order nibbles of the specified Data Memory are interchanged. The result is stored in the Accumulator. The contents of the Data Memory remain unchanged. ACC.3 ~ ACC.0 [m].7 ~ [m].4 ACC.7 ~ ACC.4 [m].3 ~ [m].0 None Skip if Data Memory is 0 If the contents of the specified Data Memory is 0, the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program proceeds with the following instruction. Skip if [m] = 0 None Skip if Data Memory is 0 with data movement to ACC The contents of the specified Data Memory are copied to the Accumulator. If the value is zero, the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program proceeds with the following instruction. ACC [m] Skip if [m] = 0 None Skip if bit i of Data Memory is 0 If bit i of the specified Data Memory is 0, the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0, the program proceeds with the following instruction. Skip if [m].i = 0 None Read table (current page) to TBLH and Data Memory The low byte of the program code (current page) addressed by the table pointer (TBLP) is moved to the specified Data Memory and the high byte moved to TBLH. [m] program code (low byte) TBLH program code (high byte) None Read table (last page) to TBLH and Data Memory The low byte of the program code (last page) addressed by the table pointer (TBLP) is moved to the specified Data Memory and the high byte moved to TBLH. [m] program code (low byte) TBLH program code (high byte) None
Affected flag(s) SZ [m] Description
Operation Affected flag(s) SZA [m] Description
Operation Affected flag(s) SZ [m].i Description
Operation Affected flag(s) TABRDC [m] Description Operation
Affected flag(s) TABRDL [m] Description Operation
Affected flag(s)
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XOR A,[m] Description Operation Affected flag(s) XORM A,[m] Description Operation Affected flag(s) XOR A,x Description Operation Affected flag(s) Logical XOR Data Memory to ACC Data in the Accumulator and the specified Data Memory perform a bitwise logical XOR operation. The result is stored in the Accumulator. ACC ACC XOR [m] Z Logical XOR ACC to Data Memory Data in the specified Data Memory and the Accumulator perform a bitwise logical XOR operation. The result is stored in the Data Memory. [m] ACC XOR [m] Z Logical XOR immediate data to ACC Data in the Accumulator and the specified immediate data perform a bitwise logical XOR operation. The result is stored in the Accumulator. ACC ACC XOR x Z
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Package Information
16-pin NSOP (150mil) Outline Dimensions
A 1
16 9 8
B
C C' G H D E F
a
* MS-012
Symbol A B C C D E F G H a Symbol A B C C D E F G H a
Dimensions in inch Min. 0.228 0.150 0.012 0.386 3/4 3/4 0.004 0.016 0.007 0 Nom. 3/4 3/4 3/4 3/4 3/4 0.050 3/4 3/4 3/4 3/4 Dimensions in mm Min. 5.79 3.81 0.30 9.80 3/4 3/4 0.10 0.41 0.18 0 Nom. 3/4 3/4 3/4 3/4 3/4 1.27 3/4 3/4 3/4 3/4 Max. 6.20 3.99 0.51 10.01 1.75 3/4 0.25 1.27 0.25 8 Max. 0.244 0.157 0.020 0.394 0.069 3/4 0.010 0.050 0.010 8
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HT48RA0-5
20-pin SSOP (150mil) Outline Dimensions
20
A
11
B
1
C C'
10
G H
D E F
a
Symbol A B C C D E F G H a Symbol A B C C D E F G H a
Dimensions in inch Min. 0.228 0.150 0.008 0.335 0.049 3/4 0.004 0.015 0.007 0 Nom. 3/4 3/4 3/4 3/4 3/4 0.025 3/4 3/4 3/4 3/4 Dimensions in mm Min. 5.79 3.81 0.20 8.51 1.24 3/4 0.10 0.38 0.18 0 Nom. 3/4 3/4 3/4 3/4 3/4 0.64 3/4 3/4 3/4 3/4 Max. 6.20 4.01 0.30 8.81 1.65 3/4 0.25 1.27 0.25 8 Max. 0.244 0.158 0.012 0.347 0.065 3/4 0.010 0.050 0.010 8
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Product Tape and Reel Specifications
Reel Dimensions
T2 D
A
B
C
T1
SOP 16N (150mil) Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 330.01.0 100.01.5 13.0
+0.5/-0.2
2.00.5 16.8
+0.3/-0.2
22.20.2
SSOP 20S (150mil) Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 330.01.0 100.01.5 13.0
+0.5/-0.2
2.00.5 16.8
+0.3/-0.2
22.20.2
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Carrier Tape Dimensions
D
E F W C
P0
P1
t
B0
D1
P A0
K0
R e e l H o le p a c k a g e p in 1 a n d th e r e e l h o le s a r e lo c a te d o n th e s a m e s id e . IC
SOP 16N (150mil) Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 16.00.3 8.00.1 1.750.1 7.50.1 1.55 1.50
+0.10/-0.00 +0.25/-0.00
4.00.1 2.00.1 6.50.1 10.30.1 2.10.1 0.300.05 13.30.1
SSOP 20S (150mil) Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Description Carrier Tape Width Dimensions in mm 16.0
+0.3/-0.1
8.00.1 1.750.10 7.50.1 1.5 1.50
+0.1/-0.0 +0.25/-0.00
4.00.1 2.00.1 6.50.1 9.00.1 2.30.1 0.300.05 13.30.1 37 June 10, 2010
Rev.1.10
HT48RA0-5
Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538 Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com
Copyright O 2010 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
Rev.1.10
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June 10, 2010


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